Micro ball grid array μbga.
Ceramic semiconductor packages.
High pin count semiconductor packaging.
This was the first real semiconductor package.
These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest.
Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap.
Miniature ceramic packages for crystal devices.
However the simple construc.
For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs.
Located in silicon valley spectrum semiconductor materials inc.
Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins.
Three engineers from fairchild.
The pressed ceramic packages are typically lower in cost than the multilayer packages.
Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.
Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.
Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.
The first semiconductor package.
Ceramic column grid array ccga.
Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers.
Is a world wide authorized distributor of packages and lids for ic assembly.
Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations.
Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics.
A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads.
Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications.
Ball spacing less than 1 mm.
Dip packages came into volume production in early 70 s.
Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements.
